通过表面层理论和金属晶体塑性变形原理解释微细薄板材料在塑性变形中产生尺寸效应的内在机理。引入尺度参数，对经典的Hall-Petch公式进行修正，建立基于表面层模型理论的尺度依赖材料模型。利用所建立的材料模型分析微细薄板厚度及其晶粒尺寸对材料成形流动性能的影响。在晶粒尺寸一定的情况下，随着微细薄板厚度的减小，材料流动应力逐渐降低；晶粒尺寸越大的微细薄板，其流动变形的尺寸效应现象越明显。利用不同厚度的不锈钢和纯铜箔材的微细薄板拉伸真应力-应变曲线对所建立的材料模型进行验证，计算结果与实验结果比较吻合，验证了所建立的材料模型的合理性。

The inherent mechanism of size effect in micro-sheet material behavior of plastic forming was explained by the surface layer model and theory of metal crystal plasticity. A size-dependant constitutive model based on the surface layer model was established by introducing the scale parameters and modifying the classical Hall-Petch equation. The influence of the geometric dimensions and the grain size on the flow behavior of the material was discussed using the new material constitutive model. The results show that, the flow stress decreases while the sheet metal thickness decreases when the grain size keeps constant, and the micro-sheet metal with a larger grain size is more easily to be influenced by the size effects. The material constitutive model established is validated by the stress-strain curve of the micro-sheet metal with different thicknesses derived from the tensile experiments. The rationality of the material model is verified by the fact that the calculation results are cons

采用铜箔/90W-10Ni(质量分数)混合粉末/镍箔多中间层，在加压5 MPa、连接温度1150°C、保温60 min的工艺条件下，对纯钨(W)和0Cr13Al铁素体不锈钢进行真空扩散连接。利用SEM、EDS、电子万能试验机及水淬热震实验等手段研究接头的微观组织、成分分布、断口特征、力学性能及抗热震性能。结果表明，连接接头由钨母材/Cu-Ni合金层/W-Ni复合材料层/镍层/钢母材五部分组成。接头中的W-Ni复合材料层由90W-10Ni混合粉末固相烧结而生成，其组织均匀、致密。W-Ni复合材料层与钨母材以瞬间液相扩散连接机制来实现良好结合。接头剪切强度达到256 MPa，断裂均发生在W-Ni复合材料层与镍层的结合区域，断口形貌呈现为韧性断裂。经过60次700°C至室温的水淬热震测试，接头无裂纹出现。

Diffusion bonding between tungsten and 0Cr13Al stainless steel using a Cu/90W-10Ni powder mixtures/Ni multi-interlayer was carried out in vacuum at 1150 °C with a pressure of 5 MPa for 60 min. The microstructures, composition distribution and fracture characteristics of the joint were studied by SEM and EDS. Joint properties were evaluated by shear experiments and thermal shock tests. The results showed that the joints comprised tungsten/Cu-Ni sub-layer/W-Ni composites sub-layer/Ni sub-layer/0Cr13Al stainless steel. The W-Ni composites sub-layer with a homogeneous and dense microstructure was formed by solid phase sintering of 90W-10Ni powder mixtures. Sound bonding between tungsten base material and W-Ni composites sub-layer was realized based on transient liquid phase (TLP) diffusion bonding mechanism. Joints fractured at bonding zone of W-Ni composites sub-layer and Ni sub-layer during shear testing, and the average strength was 256 MPa. Thermal shock tests showed that joints could

高精压延铜箔有市场需求作支撑,又有高额的盈利空间做回报,但是由于高精压延铜箔生产技术的门槛较高,到目前为止我国没有一家形成生产规模的高精压延铜箔企业。虽然这两年也有几家压延铜箔企业上马,但是距离形成生产能力还有较长的一段路程。

There are both high market demand and considerable proift margin for the high precision rolled copper foil in China. However, due to the high production technique as obstacle, so far in high precision rolling copper foil industry, there is still no Chinese enterprise that has the ability to form the production scale. Although, several rolled copper foil enterprises have invested in this ifeld in recently years, there is still a long way to go to set up the production capacity.

上进液式铜箔一体机设备是一种新型的铜箔生产设备,主要包括阴极辊、阳极槽、电解液输送装置、电解液回流接收装置等,它与传统的铜箔生产设备不同之处在于,将传统设备的"下进液式"电解液由下而上的流动,改为"上进液式"电解液由上而下的流动,并在电解液流入端口设有流量调节装置,从而提高了电解液的流动速度和平稳性,也使铜箔的均厚得到很好的控制。

The top down liquid copper equipment is a new copper production equipment, mainly including a cathode rol, a anode reservoir,electrolyte transport devices, electrolyte reflow receiving devices, etc. It is different from the traditional copper production equipment. The electrolyte of the traditional equipment flows from the bottom up. while the electrolyte of new copper production equip-ment flows from the top down. The flow control device is instal ed in its inflow port to increase the flow of electrolyte speed and stabili-ty and control the thickness of the copper foil perfectly.

压合工序是线路板工厂中最重要的工序之一，铜皱问题是行业内推广薄铜箔最大的阻碍。文章通过自行设计简易试验装置，设计对比试验，分析了压合铜箔皱的机理，阐述了温度均匀性对铜皱的影响，完善了行业内对该问题的理论认识；提出了一种针对铜皱问题全新的解决思路和方法即通过参考树脂融化点调整压合程序的方式解决压合铜箔皱问题。

Lamination is one of the most important processes in multilayer PCB manufacture. The copper wrinkles is the most difficulty to promote thin copper application. The article analyses the theory of wrinkle throughout design facility tester and DOE, expounds the impact of temperature equality to wrinkle, consummates the theory to the crush. Besides these, a kind of brand-new idea and method is proposed through regulating lamination procedure reference to resin melt.