聚焦离子束技术凭借其独特的微纳尺度制造能力和优势,已成为纳米科技工作者不可或缺的工具之。随着新型FIB硬件设备的多功能化,FIB三维表征技术的不断完善,使FIB三维表征技术在材料研究领域的应用更加广泛和深入。与其他三维表征技术相比,FIB三维表征技术具有控制精度高、分析微观区域大、分辨率高等特点。FIB技术与SIMS、SEM、EDX、EBSD等系统的结合,可对不同材料进行三维空间状态下的形貌、成分、取向等信息的分析。文章简要概述了3DSIMS、3D-Imaging/EDX、3D-EBSD 4种基于FIB的三维表征技术,具体包括FIB三维表征技术的成像-切割的原理及过程。综述了几种不同表征手段在各种材料中的应用和发展。后指出FIB三维表征技术在应用中的些不足并对该技术发展方向进行了展望。
Focused ion beam( FIB) technology has become one of indispensable tools in nano technology area with its u-nique micro-Nano-scale manufacturing capability and advantages .With multi-functionalizing of the new type hardware and improving of the 3D characterization technology, the applications of FIB 3D characterization technology in the field of ma-terials research became more extensive and in-depth.FIB 3D characterization technology has many distinctive features, compared to other 3D characterization technology, such as highly controllable accuracy, largely detectable region, high resolution and so on.FIB technology can analyze the morphology, composition, orientation of different materials in three-dimensional space conditions when it is combined with SIMS , SEM, EDX or EBSD systems.This paper briefly summa-rized four different 3D characterization technologies that include 3D-SIMS, 3D-Imaging/EDX and 3D-EBSD, and intro-duced the details of imaging-cutting principle and process of FIB