新型无铅焊料Sn-4.5Zn-2Bi-In-P、Sn-9Zn-2.5Bi-In-P具有优异的抗氧化、抗腐蚀性能，弥补了Sn-Zn系焊料润湿性能方面的不足，具有极大的实用性。测量了共晶Sn-9Zn、两种新型Sn-Zn系无铅焊料和传统的Sn-37Pb焊料的各项物理性能：密度、熔点、线膨胀系数、电阻率及对铜基体的润湿角。实验结果表明，新型Sn-Zn系无铅焊料的密度约为传统Sn-37Pb焊料的3/4；熔点（依次为194℃，191.9℃）接近Sn-37Pb焊料，熔程仅为8℃；在25~100℃，新型Sn-Zn焊料线膨胀系数依次为20.8×10-6/℃、16.9×10-6/℃，优于Sn-37Pb焊料（21.2×10-6/℃）；新型Sn-Zn焊料的电阻率依次为1.73×10-6Ω·m、1.79×10-6Ω·m，优于Sn-37Pb焊料（1.96×10-6Ω·m）；新型Sn-Zn焊料对Cu基体的润湿角接近30°，满足实用化的最低要求。

Due to the excellent oxidation resistance and corrosion resistance, which make up for the wet ability deficiency of Sn-Zn solder, new lead-free solder Sn-4.5Zn-2Bi-In-P and Sn-9Zn-2.5Bi-In-P have great practicability. The physical properties:density, melting point, linear expansion coefficient, resistivity and wetting angle on copper substrates of all four solders:Sn-9Zn, two new Sn-Zn lead-free solders and Sn-37Pb were measured. Experiments show that, the density of new Sn-Zn lead-free solder is 3/4 of the density of Sn-37Pb; melting point(194℃, 191.9℃, respectively) is close to Sn-37Pb, and melting range is only 8℃; during 25-100℃, the linear expansion coefficients of Sn-4.5Zn-2Bi-In-P and Sn-9Zn-2.5Bi-In-P are 20.8×10-6/℃,16.9×10-6/℃, respectively, better than Sn-37Pb(21.2×10-6/℃); Resistivities of Sn-4.5Zn-2Bi-In-P and Sn-9Zn-2.5Bi-In-P are 1.73×10-6 Ω·m, 1.79×10-6 Ω·m, respectively, better than Sn-37Pb (1.96×10-6Ω·m);wetting angle on Cu substrate of tw

电子封装互连过程中,无铅锡基焊料是常用的连接材料。然而,由于其较高的熔点(210~240℃),在电子器件连接过程中需施加较高的回流温度,这不仅增加了电子组装过程中的能耗,也大大降低了器件的可靠性。纳米无铅焊料具有热力学尺寸效应,其熔点较块体材料有大幅度的降低,从而受到了越来越广泛的关注。综述了近年来国内外纳米无铅焊料的发展动态,介绍了常用的纳米无铅焊料的制备方法及影响纳米颗粒尺寸的因素,总结了纳米无铅焊料在应用和存放过程中所产生的问题,同时也对纳米无铅焊料未来产业化的实现提出了建议。

Lead-free solder alloys are widely used in electronic packaging. However, due to the limitation of their high melting point (210~240℃), a great temperature must be applied during soldering. The increased working temperature not only increases the energy consumption but also threatens the joint reliability. Nano lead-free solder alloys are being attracted more and more attentions because the melting point of an alloy in nano size is much lower than that in normal size due to the thermodynamic size effect. Review the recent domestic and international developments of the nano lead-free solder alloys, introduce their preparation methods and influencing factors, summarize the problem during their application and storage, and finally, propose some advice in their industrial implementation.

近年来，热风整平无铅焊料作为一种无铅化的表面处理方式，因其低廉的加工成本及较好的表面润湿性而受到很多PCB生产厂家的青睐。同时，无铅焊料在应用过程中也暴露了诸多的问题，比如无热风整平无铅焊料产品在下游客户端做回流焊接工艺时，经过一两次的高温回流后，锡面会出现一定程度的发黄现象。本文主要针对此类发黄情况，深入研究探讨了微量元素Ge对无铅焊料的影响以及对发黄改善的机理，通过理论与实践相结合，研究并得出了在热风整平无铅焊料过程中，Ge(锗)浓度的变化规律及其合理的控制方法、以及Ge浓度对无铅焊料性能的具体影响情况。

In recent years, HASL as a surface treatment of lead-free, favored by many PCB manufacturers because of its low cost and good surface wettability. At the same time, in the application process , lead-free solder also exposed many problems, such as lead-free HASL products in the lower reaches of the client to do the relfow soldering process, after 1~2 times of high temperature relfow, tin surface will become yellow in certain degree. This paper mainly aims at this kind of yellow, in-depth study of the effects of Ge element on the regularity of lead-free HASL products become yellow after relfow, through the combination of theory and practice, research in lead-free HASL process, the changes of Ge content and its reasonable control methods, as well as the inlfuence of Ge content on the lead-free HASL products become yellow after relfow.

电子产品无铅化的推广带动了无铅焊料技术的发展，考虑到成本因素，部分铜材已被铝材取代。普通的锡铜系和锡银铜系焊料在铜铝焊接时，存在电化学腐蚀问题，因此多用锡锌焊料进行焊接。但锡锌焊料的焊点脆，存在易开裂的问题。针对电工电子器件铜铝焊接点存在的问题，提出了Sn—Zn-X多元合金焊接材料，并做了大量实验，取得很好的效果。

Lead-free electronic products led the development of lead-free solder technology. Taking cost factors into account, some copper material has been replaced by aluminum material. When ordinary Sn-Cu and Sn-Ag-Cu solder are used in soldering of Cu-Al, there is the electrochemical corrosion problems. So Sn-Zn solder is used for Cu-Al soldering. However, the joints of Sn-Zn solder are brittle and easy to crack. Focus on problems in Cu-Al soldering joint of electrical and electronic devices, put forward Sn-Zn-X alloy soldering materials, did a large number of experiments, and achieved good results.

为解决紫外成像器件光电阴极与管体封接漏气问题,对管体InSn合金熔化过程中出现的质量问题进行了深入分析,找出焊料熔层缺陷主要来源于对焊料除气不彻底和基底表面氧化及设备油污染。通过优化工艺参数,改进工艺质量和把化铟设备管体搁置焊料熔化改为浇铸熔化,使管体焊料熔化合格率达到了100%,光电阴极与管体封接气密性成品率达到98%。

To solve the problem of ultraviolet imaging device sealing leakage between the photo‐cathode and the tube body ,we deeply analyzed the quality problem of the tube body InSn alloy in melting process ,and found out the solder melting layer defect came mainly from the incom‐pletely solder degassing ,the basal surface oxidation and the equipment contaminated with oil . Through optimizing the process parameters ,we improved the process quality and changed the indium equipment of the tube body aside solder melting into casting molten ,to make the quali‐fied rate of the tube body solder melting reache 100% and the qualified rate of gas tightness be‐tween photocathode and tube body sealing yield to 98% .