随着科学技术和人们对物质生活的不断提高，印制板电子产品日新月异；液晶显示器用的背光源电路板产品正由LCD向铝基LED进行变更；铝基LED产品席卷重要的背光源电子产品领域，而混合材质LED线路板是铝基LED背光源线路板的升级产品。混合材质线路板是在一个平面上有两种不同的材质结合，一边是铝质板材，一边是铝基铜面板材，文章介绍了混合材质线路板在选择性压合制作方面的技术，以供同行业参考。

Along with the science and technology development and people unceasing life enhancement, PCB electronic products change with each passing day. Liquid crystal displays PCB used as the back light are changing from LCD to aluminum LED. Hybrid material circuit board means in a plane there are two kinds of different material combination, one is the aluminum plate, one is the aluminum copper surface plate. This paper introduces the hybrid material circuit board key production technology, for the industry reference.

为改善高导热铝基覆铜板剥离强度、击穿电压稳定性和绝缘可靠性,通过二次涂覆法在铜箔表面涂覆不同导热填料含量的复合粘结剂,制得一种高导热铝基覆铜板,并与一次涂覆法制备的高导热铝基覆铜板进行性能对比分析。结果表明:两种涂覆方法制备的高导热铝基覆铜板的绝缘层中填料分散均匀,其导热系数和热阻差异较小,都能通过288℃极限(带铜)浸锡和PCT测试;采用二次涂覆法制备的高导热铝基覆铜板的剥离强度和耐电压值均比一次涂覆法的有较大的提高。

To improve the peel strength, breakdown voltage, and insulating reliability of high thermal con-ductive aluminum based copper clad laminate(CCL), we prepared a high thermal conductive aluminum based CCL by coating the varnish with different content of thermal conductive filler on the copper foil surface twice, and its property was compared with the property of the aluminum based CCL prepared by once coating method. The results show that the filler can both well disperse in the insulation layer of the high thermal conductive aluminum based CCL prepared by the two methods, their thermal conductivi-ty and thermal resistance have little difference, and both of them can pass solderability test(with copper) and pressure cooker test(PCT). The high thermal conductivity aluminum base CCL prepared by twice coat-ing method has higher peel strength and breakdown voltage than that of the aluminum base CCL pre-pared by once coating method.

利用多弧离子镀技术在Ti2AlNb基合金表面制备镀铝层。采用SEM、EDS和XRD分析了膜层的显微组织、化学成分及其相组成,研究了镀铝层的850℃高温抗氧化性能。结果表明:Ti2AlNb基合金的镀铝层是均匀、致密的,经850℃高温氧化100 h后,表面氧化层主要是Al2O3,次表层是TiAl3、TiNb4,镀铝有效地提高了Ti2AlNb基合金的高温抗氧化性能。

An aluminum coating was applied on Ti2AlNb-base alloy by multi-arc ion plating (MAIP) technology. The microstructure , chemical composition and phase constituent of the coating were tested by means of SEM , EDS and XRD.The high temperature oxidation behavior of the aluminum coating at 850 ℃ were investigated .The results show that the aluminum coating is compact and homogeneous , and the oxide film resulting from heating the aluminum plated Ti 2 AlNb-base alloy at 850 ℃for 100 h was consisted mainly of outer Al 2 O3 and inner TiAl 3 and TiNb4 ,high temperature oxidation resistance of Ti 2 AlNb-base alloy being considerably improved .

采用磁控溅射法在阳极氧化预处理过的铝板上沉积氮化铝薄膜,制备氮化铝-铝复合基板。制备的氮化铝为非晶态,抗电强度超过700 V/μm,阳极氧化铝抗电强度达75 V/μm。当阳极氧化铝膜厚约10μm、氮化铝膜约1μm时,制备的复合封装基板击穿电压超过1350 V,绝缘电阻率1.7×106 MΩ·cm,氮化铝与铝板的结合强度超过8 MPa;阳极氧化铝膜作为缓冲层有效缓解了氮化铝与铝热膨胀系数失配的问题,在260℃热冲击下,铝板未发生形变,氮化铝膜未破裂,电学性能无明显变化。氮化铝与阳极氧化膜的可见光高透性保持了镜面抛光金属铝的高反射率,当该复合基板应用于LED芯片COB封装时,有助于提高封装光效。

AlN-Al composite substrate is fabricated by depositing AlN thin film on the anodized aluminum. The AlN and Anodized Aluminum Oxidation (AAO) film are amorphous and the dielectric strength exceeding 700 V/μm and 75 V/μm, respectively. When the thicknesses of AlN and AAO are 1μm and 10μm, the breakdown voltage and resistivity are larger than 1350 V and 1.7×106 MΩ·cm. The bond strength of AlN and Al reaches 8 MPa. AAO film, as a buffer layer, reduces the mismatch of Temperature Expansion Coefficient (TEC) between AlN and Al. Thus, when the temperature of thermal shock reaches 260℃, the aluminum substrate does not deform, and the AlN film not crack. The high transparency of AlN and AAO film keeps the high reflectivity of polished aluminum. Thus AlN-Al substrate can improve the light extraction, when used in the COB package of LED chip.

采用粒径为400 nm的纳米级氮化铝对聚酰亚胺进行填充，制备了纳米氮化铝增强的聚酰亚胺基覆铜板，研究了纳米氮化铝含量对聚酰亚胺膜及聚酰亚胺基覆铜板各项性能的影响。结果表明：随着纳米氮化铝含量的增加，聚酰亚胺膜的热导率、热稳定性相应增加，而断裂延伸率及其与铜箔之间的剥离强度则大幅下降。当纳米氮化铝的含量为40%时，聚酰亚胺膜基覆铜板的综合性能最佳。

A polyimide based copper clad laminate was prepared by filling 400nm size aluminum nitride to poly-imide, and the effects of nano aluminum nitride content on the various properties of the polyimide film and polyimide based copper clad laminate were studied. The results show that with the increase of nano aluminum nitride content, the thermal conductivity and thermal stability of the PI film increase, and the elongation at break of the PI film and the peel strength between PI film and copper foil decrease greatly. When the nano alu-minum nitride content is 40%, the polyimide based copper clad laminate has the best comprehensive properties.